Come visit us at PACK EXPO Chicago
Come see us at PACK EXPO 2026 in Chicago from October 18 to 21, 2026, and discover our innovative ultrasonic technology for the packaging industry.
Held every two years, PACK EXPO Chicago offers you a unique opportunity to experience the latest developments in packaging, processing, and automation all in one place. Discover innovative packaging materials, cutting-edge technologies, and fascinating robotics solutions. Be inspired by live demonstrations, compare solutions, and gain valuable insights for your future projects.
Visit RINCO ULTRASONICS and gain exclusive insights into our ultrasonic technology, developed specifically for the packaging industry. See firsthand how our products can be used efficiently in a wide range of packaging applications.
Visit us at Booth S-1403 - we look forward to seeing you there!
